Title:
化学機械研磨用アルミナ砥粒及びその製造方法
Document Type and Number:
Japanese Patent JP7167557
Kind Code:
B2
Abstract:
Provided are alumina abrasive grains for chemical mechanical polishing that: suppress the occurrence of polishing scratches during chemical mechanical polishing when wiring semiconductor devices, while providing high-speed polishing of a surface to be polished; and have excellent dispersion stability in a composition. These alumina abrasive grains for chemical mechanical polishing have: at least part of the surface thereof coated by a silane compound coating; a value for MSi/MAl of 0.01–0.2, when the number of mols of silicon is MSi and the number of mols of aluminum is MAl; and a full width at half maximum value of 0.3–0.5° for the peak at which the refractive strength is greatest in an incident angle range of 25–75°in a powder X-ray diffraction pattern.
Inventors:
Wang Peng Yu
Nakanishi Koji
Tatsuya Yamanaka
Nakanishi Koji
Tatsuya Yamanaka
Application Number:
JP2018161241A
Publication Date:
November 09, 2022
Filing Date:
August 30, 2018
Export Citation:
Assignee:
JSR CORPORATION
International Classes:
H01L21/304; B24B37/00; C01F7/02; C09K3/14
Domestic Patent References:
| JP2009062244A | ||||
| JP2014181159A | ||||
| JP2010197479A | ||||
| JP2003512501A |
Foreign References:
| WO2018147074A1 | ||||
| WO2009139450A1 |
Attorney, Agent or Firm:
Michie Obuchi
Fuse Yukio
Mitsufumi Matsumoto
Fuse Yukio
Mitsufumi Matsumoto
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