Title:
ALUMINUM BASE MATERIAL FOR TAB LEAD AND TAB LEAD
Document Type and Number:
Japanese Patent JP2014179193
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a tab lead which becomes excellent in adhesion when heat-sealed with a sheath sheet and which is superior in sealability of electrolyte, and also to provide an aluminum base material used for the same.SOLUTION: Disclosed is an aluminum base material for a tab lead which is used for a power storage device for sealing a positive electrode, a negative electrode, and an electrolyte by heat-sealing a sheath sheet and the tab lead. On the surface heat-sealed with the sheath sheet, an arithmetic average roughness Ra of a roughness curve is 0.20 to 0.80 μm, an arithmetic average inclination Δa of the roughness curve is 0.35 rad or less, the average length RSm of contour curve elements of the roughness curve is 35 μm or more, and the maximum cross-sectional height Pt in a cross sectional curve is 5.0 μm or less.
Inventors:
KASUYA YUICHI
HATANAKA YUSUKE
MATSUNAGI JUN
YASUHARA YUICHI
HATANAKA YUSUKE
MATSUNAGI JUN
YASUHARA YUICHI
Application Number:
JP2013051552A
Publication Date:
September 25, 2014
Filing Date:
March 14, 2013
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
H01M2/30; H01M2/06
Domestic Patent References:
| JP2001148234A | 2001-05-29 | |||
| JPH11242953A | 1999-09-07 | |||
| JP2001243939A | 2001-09-07 | |||
| JP2001059187A | 2001-03-06 | |||
| JP2005158264A | 2005-06-16 |
Attorney, Agent or Firm:
Mochitoshi Watanabe
Haruko Miwa
Hideaki Ito
Mitsuhashi Fumio
Haruko Miwa
Hideaki Ito
Mitsuhashi Fumio
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