Title:
ALUMINUM WIRE BONDING PAD AND PRODUCTION THEREOF
Document Type and Number:
Japanese Patent JP3440635
Kind Code:
B2
Abstract:
PURPOSE: To enhance the reliability when an aluminum wire is bonded to an Ni based plating film laminated on a pad having an Fe-Ni based composition.
CONSTITUTION: A surface reforming layer having Rz of 0.3μm or less is formed on the entire surface including the solder bonding face 11 and the wire bonding face 13 of a pad body 10 having an Fe-Ni based composition. An Ni based plating film 10x is laminated on the surface reforming layer. The Ni based plating film 10x is soldered, on the solder bonding surface 11 side, to the mounting face 20a of an electronic substrate 20 and an aluminum wire 55 is bonded, by thermosonic wire bonding, to the Ni based plating film 10x on the wire bonding face side 13.
Inventors:
Koji Edagawa
Takayuki Koike
Ishimaru Risa
Kenji Shimoda
Chiyoshi Maeda
Takayuki Koike
Ishimaru Risa
Kenji Shimoda
Chiyoshi Maeda
Application Number:
JP15640495A
Publication Date:
August 25, 2003
Filing Date:
June 22, 1995
Export Citation:
Assignee:
Aichi Steel Co., Ltd.
TOYOTA JIDOSHA KABUSHIKI KAISHA
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
H01L21/60; H01B5/02; (IPC1-7): H01L21/60
Domestic Patent References:
| JP5979539A | ||||
| JP603189A |
Attorney, Agent or Firm:
Hiroshi Ohkawa