Title:
非晶質合金滑走ボード
Document Type and Number:
Japanese Patent JP4216604
Kind Code:
B2
Abstract:
Gliding board devices and methods of making gliding board devices wherein at least a portion of the devices is formed of a bulk amorphous alloy material are provided. The gliding board device including an upper reinforcing element that covers at least the upper surface of the device; a lower reinforcing element; a sliding element; a pair of running edges; and a core of filler material disposed between the upper and lower element, wherein at least one of the upper reinforcing element, lower reinforcing element and pair of running edges are formed from an amorphous alloy.
More Like This:
| WO/1998/042418 | SLIDING BOARD |
Inventors:
Peker, Atakan
Scott Wiggins
Scott Wiggins
Application Number:
JP2002570783A
Publication Date:
January 28, 2009
Filing Date:
March 07, 2002
Export Citation:
Assignee:
Liquid Metal Technologies, Incorporated
International Classes:
A63C5/12; A63C5/00; A63C5/044; A63C5/048; A63C5/056; A63C5/14; B32B27/00; C22C45/02; C22C45/04; C22C45/06; C22C45/08; C22C45/10; C22C49/00
Domestic Patent References:
| JP59069777U | ||||
| JP3182275A | ||||
| JP61135688A | ||||
| JP6304285A | ||||
| JP3176089A | ||||
| JP9256122A | ||||
| JP9041104A | ||||
| JP11057080A |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Masaya Nishiyama
Takashi Ishida
Tetsuji Koga
Masaya Nishiyama