Title:
ＳＯＩ基板を持つマイクロ電気機械システム用アンカー及びその製造方法
Document Type and Number:
Japanese Patent JP5748701
Kind Code:
B2
Abstract:
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.
Inventors:
Lutz, Marx
Partridge, Aaron
Clone Muller, Sylvia
Partridge, Aaron
Clone Muller, Sylvia
Application Number:
JP2012103278A
Publication Date:
July 15, 2015
Filing Date:
April 27, 2012
Export Citation:
Assignee:
ROBERT BOSCH GMBH
International Classes:
B81C1/00; B81B3/00; G01C19/5769; G01P15/00; G01P15/125; H01L21/00; H01L27/01; H01L29/82; H01L29/84; H01L
Domestic Patent References:
| JP2000164890A | ||||
| JP2000138381A |
Foreign References:
| WO2001058804A2 | ||||
| WO2001058803A2 | ||||
| WO2001077009A1 | ||||
| US20030049878 |
Attorney, Agent or Firm:
Shinjiro Ono
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto
Yukio Kanegae
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto
Yukio Kanegae