Title:
ANISOTROPIC CONDUCTIVE SYNTHETIC MEDIUM AND MUTUALLY CONNECTED DEVICES BY THE MEDIUM
Document Type and Number:
Japanese Patent JP3441871
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To increase resistance against thermal and mechanical stresses by preparing a non-conductive base material having a predetermined channel, filling the channel with a liquid precursor, turning the liquid into a conductive material, and then, forming a solder bump.
SOLUTION: A base is prepared which has a pair of main surfaces, is made of a non-conductive base material, and includes a vertical or substantially vertical channel between the main surfaces. In this case, a diameter of the vertical channel ranges from 100 &angst to 100,000 &angst . In the case where the channel is filled with a conductive liquid precursor, a thin film is placed transverse to a suction head 21 to be evacuated at one of the main surfaces of a base thin film 20, and the other surface is located in contact with the precursor liquid 22, to thus fill the channel 23 with the liquid. The liquid 22 is turned into a conductive material, thereby forming a solder bump. Consequently, it is possible to form a hollow tube or a porous conductive path having increased resistance against thermal and mechanical stresses.
Inventors:
Richard Alan Fastnatch
Sango Jin
Way Zoo
Sango Jin
Way Zoo
Application Number:
JP2292796A
Publication Date:
September 02, 2003
Filing Date:
February 09, 1996
Export Citation:
Assignee:
AT&T CORP.
International Classes:
H01L39/24; H01B5/16; H01B12/02; H01B13/00; H01L21/48; H01L23/498; H01L39/06; H01R12/71; H01R13/24; H01R43/00; H05K3/34; H05K3/10; H05K3/40; (IPC1-7): H01B13/00; H01B5/16; H01L39/06; H01L39/24
Domestic Patent References:
| JP6394504A | ||||
| JP6340218A | ||||
| JP2149675A |
Attorney, Agent or Firm:
Masao Okabe (2 outside)