To obtain a thermosetting type anisotropic electroconductive adhesive that permits electric connection between microfine circuits, for example, between a liquid crystal display(LCD) and a tape carrier package(TCP) or between TCP and a printed circuit board(PCB) in low temp. and in short time and shows excellent adhesion, persistent reliability, storage stability and repair properties.

This anisotropic electroconductive adhesive essentially contains (A) a (meth)acryloyl novolak resin bearing phenolic hydroxyl groups that has a chemical structure of formula I (where R1 is H or methyl: R2 is H or methyl; m/(m+n)=0.3-0.9/1; m+n is 5-10) as a radically polymerizable resin, (B) an organic peroxide, (C) a thermoplastic elastomer, (D) maleimide, (E) an aminosilane coupling agent and (F) electroconductive particles dispersed in the resin components where the formulation of these components is in the range of the formula: (E)/{(A)+(B)+(C)+(D)}=(0.1-10)/100.