Title:
ANTIELECTROSTATIC MOLDING
Document Type and Number:
Japanese Patent JPH0324144
Kind Code:
A
Abstract:
PURPOSE:To obtain an antielectrostatic molding improved in permanent antielectrostatic properties, mechanical properties and heat stability by molding a resin composition containing a styrene resin and a specified polyamideimide elastomer. CONSTITUTION:A polyamideimide elastomer having a relative viscosity >=1.5 at 30 deg.C is obtained by polymerizing caprolactam with a tribasic or tetrabasic aromatic polycarboxylic acid which can form at least one imide ring and 40-80wt.% mixture of at least 50wt.% polyoxyethylene glycol of a number- average MW of 500-5000 with another polyoxyalkylene glycol at 150-300 deg.C while keeping the water content of the formed polymer at 0.1-1wt.%. 100 pts.wt. total of 80-97wt.% styrene resin and 20-3wt.% said elastomer is optionally mixed with 0.01-10 pts.wt. organic and/or inorganic electrolytes, and the resulting mixture is melt-kneaded at 180-280 deg.C and molded to obtain an antielectrostatic molding having permanent antielectrostatic properties and a surface resistivity <1.0X10<14>OMEGA/cm<2>.
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Inventors:
SAKAMOTO MASASHI
TOHARA AKIHITO
HAYASHI MITSUO
TOHARA AKIHITO
HAYASHI MITSUO
Application Number:
JP15820189A
Publication Date:
February 01, 1991
Filing Date:
June 22, 1989
Export Citation:
Assignee:
ASAHI CHEMICAL IND
International Classes:
C08L25/04; C08L73/00; C08L79/08; (IPC1-7): C08L25/04; C08L79/08
Attorney, Agent or Firm:
Akira Agata (2 outside)
Next Patent: JPH0324145