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Title:
ANTIFUNGAL COMPOSITION OF WOOD
Document Type and Number:
Japanese Patent JP2007015126
Kind Code:
A
Abstract:

To provide an antifungal composition of wood used for preventing the generation of fungi in wood and preferably used together with a water soluble wood pressure injection type preservative and ant-proof agent based on a copper salt or copper oxide.

The antifungal composition of wood contains at least one compound selected from the group consisting of ±1-[2-(2,4-dichlorophenyl)-2-(2-propinyloxy)ethyl]-1H-imidazole or its acid addition salt, 2-n-octyl-4-isothiazolin-3-one, N-n-butyl-1, 2-benzisothiazolin-3-one, as an effective component. In a case that the antifungal composition of wood is combined with the treatment liquid of the water soluble wood pressure injection type preservative and ant-proof agent based on a copper salt or copper oxide, an antifungal capacity is drastically enhanced as compared with a case that the antifungal composition and the water soluble wood pressure injection type preservative and ant-proof agent based on a copper salt or copper oxide are respectively added, and can be kept over a long period of time without damaging preservative properties and ant-proof properties.


Inventors:
IMAI HIROSHI
Application Number:
JP2005196049A
Publication Date:
January 25, 2007
Filing Date:
July 05, 2005
Export Citation:
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Assignee:
SHINTO FINE CO LTD
International Classes:
B27K3/52
Domestic Patent References:
JP2003267806A2003-09-25
JP2003011106A2003-01-15
JP2003252705A2003-09-10