To provide an antistatic mold release film having a small charge amount at the time of a friction or a release, good transparency and no shape transfer of a ruggedness at the time of molding.

The antistatic mold release film comprises an antistatic film having a surface specific resistance value of 1×1010 Ω/(square) or less and an antistatic layer and provided on at least one surface of a base film, and further a mold release layer formed on any surface of the antistatic film. In this mold release film, the antistatic layer is formed of a vapor phase growth film and contains Fe as a main component and one or more of a metal selected from the group consisting of Ni, Cr, C, Mn, Mo, Cu and Ti.