To provide a laser processing device having a structure which enables a high-speed laser processing with respect to a semiconductor wafer having a plurality of die regions including processing points.

An apparatus for manufacturing semiconductors comprises a plurality of laser generating sources 5, 6 which, respectively, generate a laser beam for conducting a laser machining toward a machining point of a semiconductor wafer, laser beam controlling means 16-19 which, respectively, control irradiation, interception and an irradiation direction of the plurality of laser beams generated from the plurality of laser generating sources 5, 6, and a machining region determining means 15 which determines machining regions by combining die regions including the machining points in a semiconductor wafer, which are to be subjected to simultaneous machining by the plurality of laser generating sources 5, 6 and laser beam controlling means 16-19.