APPARATUS FOR MEASURING ETCHING DEPTH AND METHOD THEREFOR

Title:

APPARATUS FOR MEASURING ETCHING DEPTH AND METHOD THEREFOR

Document Type and Number:

Japanese Patent JP2001343219

Kind Code:

A

Abstract:

To provide an etching depth-measuring apparatus and a method therefor wherein etching can be stopped at a target depth even when an interference signal outputs an abnormal waveform.

In this etching depth-measuring apparatus, an etching object (7) is illuminated with light and an etching depth is measured from a pole distance of interference signals of the light reflected on a mark of the etching object (7) and the light reflected on a pattern hole. The apparatus is provided with an operation means (4) which calculates an estimated etching rate for a section where the abnormal waveform is detected when the abnormal waveform is detected in the interference signal, and operates the etching depth.

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Inventors:

SATO MASAHARU
INOMOTO MINORU
MASUKAWA KAZUYUKI

Application Number:

JP2000162083A

Publication Date:

December 14, 2001

Filing Date:

May 31, 2000

Export Citation:

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Assignee:

TOSHIBA CORP

International Classes:

G01B11/22; H01L21/302; H01L21/3065; H01L21/66; (IPC1-7): G01B11/22; H01L21/3065; H01L21/66

Attorney, Agent or Firm:

Takehiko Suzue (6 outside)

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