To provide an apparatus for measuring and handling a semiconductor device, which can perform the measurement of high-temperature characteristics of the semiconductor device such as a visible semiconductor laser diode or the like in a short time with high precision, and also which has temperature compensation higher than a conventional one, at low cost with high efficiency.

The apparatus includes a heater part 4 comprising heater blocks 17, 18 for heating the semiconductor device 9 while being pinched with a pushpin 19 attached to the heater block 17 and a positioning pawl 24 attached on the heater block 18; and a measuring part 5 for measuring the high-temperature characteristics of the semiconductor device 9 that is maintained in a predetermined temperature range in the heater part 4. The measuring part 5 measures the high-temperature characteristics of the semiconductor device 9, which is heated and positioned while being pinched with the pushpin 19 attached to the heater block 17 and the positioning pawl 24 attached on the heater block 18, and which is maintained in a predetermined temperature range. Consequently, the high-temperature characteristics of the semiconductor device 9 can be efficiently measured in a short time with high precision.