To provide an apparatus and a method for laser beam machining capable of properly machining a place where a laser beam is difficult to reach, and also of machining another place where the laser beam reaches easily without causing any damage.
The invented laser beam machining apparatus includes a laser beam source which emits a laser beam, an irradiation optical system which irradiates a workpiece placed on a plane with the laser beam emitted from the laser beam source in a direction perpendicular to the plane while the irradiating position is scanned around the workpiece and its vicinity, a beam detecting means which is placed on the side opposite to the irradiation optical system with regard to the plane and detects the laser beam with which the irradiation optical system irradiates the workpiece, and a control means which switches over between continuous oscillation and pulsed oscillation when emitting the laser beam from the laser beam source. The control means continuously oscillates the laser beam from the laser beam source when the laser beam with which the irradiation optical system irradiates the workpiece is detected by the beam detecting means, and pulsedly oscillates the laser beam from the laser beam source when the laser beam with which the irradiation optical system irradiates the workpiece is not detected by the beam detecting means.
NAKAMAE KAZUO
TAMAOKI SHINOBU
| JPS58105550A | 1983-06-23 | |||
| JPH02117788A | 1990-05-02 | |||
| JPH081366A | 1996-01-09 | |||
| JP2006292424A | 2006-10-26 | |||
| JPH08182142A | 1996-07-12 | |||
| JP2004074253A | 2004-03-11 |
Shiro Terasaki
Yoshiki Kuroki
Ichira Kondo
Masatoshi Shibata