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Patent Searching and Data


Title:
APPARATUS AND METHOD OF PROCESSING SUBSTRATE
Document Type and Number:
Japanese Patent JP2006245059
Kind Code:
A
Abstract:

To inhibit certainly that the processing liquid supplied to a substrate, in a stage after this is detoured into a substrate surface which is in a state prior to being replaced by a new processing liquid.

A portal nozzle 20 applies a curtain-like rinse liquid to the substrate front surface from a first discharge opening 2021 and a second discharge opening 2022 from the upper part of the substrate W under conveyance throughout the substrate width. Consequently, for example, from an etchant which is given at the last process and remains on the substrate front surface, energizing rinse liquid is changed to newly supplying material for a short time. The substrate conveyance direction upstream region and downstream region are partitioned in the discharge opening 202 of the portal nozzle 20. The traffic of the air current from the downstream region to the upstream region is intercepted. This avoids that mist generated in the substrate conveyance direction downstream, rather than the portal nozzle 20 when the rinse liquid is supplied from a spray nozzle adheres to the substrate part, prior to the liquid permutation mode.


Inventors:
YOSHIKAWA NORIO
Application Number:
JP2005054872A
Publication Date:
September 14, 2006
Filing Date:
February 28, 2005
Export Citation:
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Assignee:
DAINIPPON SCREEN MFG
International Classes:
H01L21/304; B65G49/00
Attorney, Agent or Firm:
Etsushi Kotani
Takao Ito
Jiro Higuchi