To provide, for example, an apparatus for molding a multilayer film which can improve work properties during maintenance without lowering the assembly accuracy of a mold.
When a plurality of unit blocks 31 are piled up, the positioning projection 34 of an upper unit block 31 enters the positioning recess 35 of a lower unit block 31. By a step part 36, the movement in the diameter direction of the upper unit block 31 is restricted and positioned in relation to the lower unit block 31. In the mating faces of the two unit blocks 31 positioned mutually vertically, pinholes 37 and 38 are formed in the lower surface 34a of the positioning projection 34 of the upper unit block 31 and the upper surface 35a of the positioning recess 35 of the lower unit block 31. By driving knock pins 39 into the pinholes 37 and 38, the mutual movement in the peripheral direction of the upper and lower unit blocks 31 is restricted.
YATEHATA YOSHIYUKI
TAKEMOTO TAKASHI
ANDO AKITAKA
IRIKO MASAYUKI
YOSHIHARA SHIGERU
SHIKOKU KAKO KK
| JP2005144758A | 2005-06-09 | |||
| JP2002079576A | 2002-03-19 | |||
| JPH071579A | 1995-01-06 |
| WO2005046970A1 | 2005-05-26 |
Horikawa Miyuki