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Title:
APPARATUS AND PROCESS FOR VACUUM DEPOSITION
Document Type and Number:
Japanese Patent JP3662874
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a vacuum deposition apparatus which enables easy operation such as setting, supplying and replacing of an evaporation source and increases the productivity.
SOLUTION: In the vacuum deposition apparatus, the evaporation source 2 and a deposition substrate 3 are positioned in a vacuum chamber 1, and the space between the evaporation source 2 and the deposition substrate 3 is surrounded by a tubular body 4 heated to a temperature allowing the substrate of the evaporation source 2 to vaporize. The substance that has vaporized from the evaporation source 2 is passed inside the tubular body 4 to reach and deposit on the surface of the deposition substrate 3. Here, the vacuum chamber 1 is divided into a deposition chamber 5 wherein the tubular body 4 is arranged and an evaporation chamber 6 wherein the evaporation source 2 is set. The evaporation chamber 6 is connected to the deposition chamber 5 freely attachably and detachably.


Inventors:
Taisuke Nishimori
Yasuo Kishi
Yukihiro Kondo
Teruo Nakagawa
Junji Kido
Yuji Yanagi
Eiichi Matsumoto
Application Number:
JP2001329675A
Publication Date:
June 22, 2005
Filing Date:
October 26, 2001
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
Junji Kido
Tokki Co., Ltd.
International Classes:
C23C14/24; (IPC1-7): C23C14/24
Domestic Patent References:
JP9272703A
JP10204622A
JP47031514B1
JP56005977A
JP57155376A
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori



 
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