Title:
APPARATUS FOR REMOVING SOLDER IN ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2010167455
Kind Code:
A
Abstract:
To obtain an apparatus for removing solder in electronic components, which easily removes solder in an electrode part without damaging an electronic component even such as a small surface-mounted component.
The apparatus includes a stretching means 1 for stretching a solder wick 2, a heating means 3 for heating a prescribed part of the solder wick stretched by the stretching means, and a transfer means 7 for transferring an electronic component 6 in which solder to be removed is stuck to an electrode 6a to the heated part of the solder wick. The apparatus is configured to remove the solder by bringing the electrode of the electronic component into contact with the heated part of the solder wick.
Inventors:
TEZUKA TOMOYA
YAMADA NAOMICHI
YAMADA NAOMICHI
Application Number:
JP2009012433A
Publication Date:
August 05, 2010
Filing Date:
January 23, 2009
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K1/018; B23K1/00; H05K3/34
Attorney, Agent or Firm:
Takenaka Ikuo
Masuo Oiwa
Toshihide Kodama
Keigo Murakami
Masuo Oiwa
Toshihide Kodama
Keigo Murakami
Previous Patent: HEAT EXCHANGER AND METHOD OF MANUFACTURING THE SAME
Next Patent: CASTING METHOD FOR CONTINUOUS CASTING DEVICE
Next Patent: CASTING METHOD FOR CONTINUOUS CASTING DEVICE