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Title:
APPARATUS FOR SUPPLYING GROOVES OF THREAD SOLDER CONTAINING FLUX
Document Type and Number:
Japanese Patent JP2010125477
Kind Code:
A
Abstract:

To provide an apparatus for supplying grooves of a thread solder containing flux, capable of securely stably advancing and retracting the thread solder per a required amount without causing the slippage of the thread solder.

A grooving roller 10 and a feed roller 11 are arranged at opposite positions with the thread solder 3 interposed therebetween at a half way of a soldering guide 9 which guides the flux-containing thread solder 3. A ring-shaped grooving blade 25 is arranged at the outer circumference of the grooving roller 10. The grooving blade 25 is configured to continuously form a groove with a depth reaching a flux storage area at one side surface of the thread solder. A plurality of engaging protrusions 26 are formed with equal pitches at the outer circumference of the feed roller 11. The thread solder 3 is configured to advance and retract by allowing the engaging protrusions 26 to engage with the other side surface of the thread solder 3.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
MIYAMA TOMOAKI
Application Number:
JP2008301197A
Publication Date:
June 10, 2010
Filing Date:
November 26, 2008
Export Citation:
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Assignee:
JAPAN UNIX CO LTD
International Classes:
B23K35/40; B23K3/06
Domestic Patent References:
JP2008264790A2008-11-06
JP2005262297A2005-09-29
JPS5760789U1982-04-10
Attorney, Agent or Firm:
Hayashi Naoki
Hiroshi Hayashi
Kotaro Hori