To provide an application technique of mold release agent, by which an optimal amount of release agent can be applied to optimal positions on a mold surface having a complex concavo-convex shape.
An application device 20 of mold release agent has a robot arm 14 which is provided with spray nozzles 12 for applying mold release agent to the surface of a mold 50, with the robot arm 14 rotatably holding the spray nozzles 12 which are capable of intermittently spraying mold release agent to the surface of the mold 50. Furthermore, it comprises a controller 18 which controls a ratio t/T where T is a period of intermittent spraying and t is a spraying time in the period T, and the controller 18 controls the ratio t/T in such a manner that the kinetic energy of mold release agent sprayed to a unit area of the mold surface in a unit time does not exceed a predetermined upper limit value.
FURUKAWA YUICHI
IGARASHI HISATO
JPH11333330A | 1999-12-07 | |||
JPH09327757A | 1997-12-22 | |||
JPS59189031A | 1984-10-26 | |||
JP2005007420A | 2005-01-13 | |||
JP2001269710A | 2001-10-02 | |||
JPH11333330A | 1999-12-07 | |||
JP2012055938A | 2012-03-22 |
Hideaki Masatsu
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