Title:
SOLDER ALLOY
Document Type and Number:
Japanese Patent JP2014024082
Kind Code:
A
Abstract:
To provide a solder alloy superior in wettability and bondability and having high joining reliability required to be used for assembling an electronic part without substantially limiting an alloy composition, and the electronic part using its solder alloy.
The solder alloy is provided by setting a thickness of an oxide layer to 120 nm or less, and setting surface roughness (Ra) to 0.60 μm or less, and its alloy composition is not particularly limited, but is desirably mainly composed of any of Bi, Pb, Sn, Au, In and Zn among these.
Inventors:
IZEKI TAKASHI
SHIMIZU JUICHI
SHIMIZU JUICHI
Application Number:
JP2012165344A
Publication Date:
February 06, 2014
Filing Date:
July 26, 2012
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
B23K35/26; B23K1/00; B23K35/30; C22C5/02; C22C11/00; C22C11/04; C22C11/06; C22C12/00; C22C13/00; C22C13/02; C22C28/00; H05K3/34; B23K35/40; B23K101/40; C22C1/02
Attorney, Agent or Firm:
Masao Yamamoto
Noriyuki Tsujikawa
Noriyuki Tsujikawa
Previous Patent: RING ROLLING MILL HAVING WORK CARRYING-OUT LIFTING MEANS
Next Patent: APPLICATION DEVICE AND APPLICATION METHOD OF MOLD RELEASE AGENT
Next Patent: APPLICATION DEVICE AND APPLICATION METHOD OF MOLD RELEASE AGENT