Title:
AQUEOUS CONTACT ADHESIVE COMPOSITION AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2002146315
Kind Code:
A
Abstract:
To obtain an aqueous contact adhesive composition which is an aqueous system having a high drying rate and capable of increasing the resin content having an excellent adhesive strength in a semidried state without damaging the environment and without any risk of a fire and to provide a method for producing the aqueous contact adhesive composition.
This aqueous contact adhesive composition comprises an aqueous emulsion containing (A) and alkyl acrylate resin having ≤0°C glass transition temperature, (B) a urethane resin and (C) a tackifier having 70-180°C softening point and is obtained by including the component (B) in an amount of 2-30 pts.wt. and the component (C) in an amount of 1-30 pts. wt. based on 100 pts.wt. of the component (A).
Inventors:
MIYANAGA HAJIME
MIYAHARA TORU
MIYAHARA TORU
Application Number:
JP2000349774A
Publication Date:
May 22, 2002
Filing Date:
November 16, 2000
Export Citation:
Assignee:
CHUO RIKA KOGYO CORP
MITSUBISHI CHEM CORP
MITSUBISHI CHEM CORP
International Classes:
C09J133/08; C09J175/04; (IPC1-7): C09J133/08; C09J175/04
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JPH10338732A | 1998-12-22 | |||
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Attorney, Agent or Firm:
Bunji Kamata (2 outside)