Title:
ADHESIVE SHEET FOR PRODUCING PROCESS OF FLEXIBLE CIRCUIT
Document Type and Number:
Japanese Patent JP2002146314
Kind Code:
A
Abstract:
To obtain an adhesive sheet used for a producing process of a flexible circuit having excellent handleability and operating efficiency.
This adhesive sheet for the production process of the flexible circuit is characterized in that an adhesive mass layer is composed of 100 pts.wt. of a resin prepared by copolymerizing dibutyl acrylate with 2-ethylhexyl acrylate and vinyl acetate and having 500,000-2,000,000 weight-average molecular weight and 2-15 pts.wt. of a cross-linking agent.
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Inventors:
ODA NAOYA
Application Number:
JP2000342955A
Publication Date:
May 22, 2002
Filing Date:
November 10, 2000
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C09J7/02; C09J131/04; C09J133/08; C09J175/04; (IPC1-7): C09J133/08; C09J7/02; C09J131/04; C09J175/04