To provide an aqueous emulsion forming such an aqueous adhesive that, in making a dry bonding, drawdown occurrence under heating is suppressed, heat-resistant creep improvement is accomplished, and satisfactory initial adhesivity is exhibited in the dry bonding by a heat treatment to the extent of drying.
The aqueous emulsion of adhesive resin comprises (A) an ethylene-vinyl acetate copolymer with a glass transition temperature of -50 to 0C and tetrahydrofuran insolubles of 70 wt.% or more, (B) a (meth)acrylic copolymer with a glass transition temperature of -50 to 0C, (C) a polyurethane resin with a flow-starting temperature of 60C or lower and (D) a crosslinking agent. The amounts of the above components are as follows: (B) 10-100 pts.wt., on a solid basis, relative to 100 pts.wt. of the component A on a solid basis, (C) 5-80 pts.wt., on a solid basis, relative to 100 pts.wt. of the component A on a solid basis, and (D) 1-30 wt.%, on a solid basis, relative to 100 wt.% of the total of the components A, B and C on a solid basis.
MAEKAWA TARO
IWATA HIROMITSU
| JP2003313527A | 2003-11-06 | |||
| JPH10287857A | 1998-10-27 | |||
| JP2004067803A | 2004-03-04 | |||
| JP2005232330A | 2005-09-02 |
Torii Kazuhisa
Takayoshi Tagawa
Masanori Kitagawa
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