Title:
MOISTURE-CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2008266521
Kind Code:
A
Abstract:
To provide a low-toxic moisture-curable resin composition which is slight in curing delay with the elapse of time, while having a practical curing rate.
The moisture-curable resin composition comprises (A) a curable silicone-based resin having in the molecule silicon-containing characteristic groups each represented by general formula (1) (wherein, R1 and R2 are each a 1C or 2C hydrocarbon group; and n is 1, 2 or 3), (B) a silane compound such as a silicate compound represented by general formula (2) (wherein, R3 is a 3C or 4C hydrocarbon group) and (C) boron trifluoride and/or its derivative as a hydrolysis catalyst.
Inventors:
INUI JUN
IYO KAZUHIRO
NOMURA YUKIHIRO
INOUE MAI
SATO SHINICHI
IYO KAZUHIRO
NOMURA YUKIHIRO
INOUE MAI
SATO SHINICHI
Application Number:
JP2007114442A
Publication Date:
November 06, 2008
Filing Date:
April 24, 2007
Export Citation:
Assignee:
KONISHI CO LTD
International Classes:
C08G18/67; C08G18/10; C08K5/5415; C08L33/14; C08L71/02
Domestic Patent References:
| JP2006199905A | 2006-08-03 | |||
| JPH07207245A | 1995-08-08 | |||
| JP2001172569A | 2001-06-26 |
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