Title:
AROMATIC POLY(AMIDE/IMIDE) RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH03221560
Kind Code:
A
Abstract:
PURPOSE:To obtain an aromatic poly(amide/imide) resin composition having excellent heat-resistance and melt-moldability by compounding a melt-flowable aromatic poly(amide/imide) resin with a specific amount of an aromatic polyimide resin having low molecular weight. CONSTITUTION:The objective resin composition is produced by compounding (A) 80-99 pts.wt. of a melt-flowable aromatic poly(amide/imide) resin derived from (A1) diamines containing >=50mol% of an aromatic diamine containing (thio)ether bond and expressed by formula I (Ar is bivalent aromatic residue; X is S or O) and (A2) aromatic polycarboxylic acids (e.g. pyromellitic acid) and containing >=50mol% of at least one of the recurring units of formula II, formula III and formula IV with (B) 20-1 pts.wt. of a low-molecular weight aromatic polyimide resin having an intrinsic viscosity of the polyamic acid of <0.4dl/g and smaller than that of the component A (measured as 0.5% N- methylpyrrolidone solution at 30 deg.C).
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Inventors:
TERAUCHI MAKOTO
YAMAZAKI KAORI
IKEDA MUTSUKO
YAMAZAKI KAORI
IKEDA MUTSUKO
Application Number:
JP1875890A
Publication Date:
September 30, 1991
Filing Date:
January 29, 1990
Export Citation:
Assignee:
MITSUBISHI PETROCHEMICAL CO
International Classes:
C08L79/08; (IPC1-7): C08L79/08
Attorney, Agent or Firm:
Kazuo Sato (2 outside)