To package plural modules constituting an array antenna feeding device with high density by covering the periphery of a multilayer substrate with a metallic layer, forming control lines and feeding lines inside and providing a connecting terminal with an airtight package within the surface where the airtight package is attached.
Microwave signals are transmitted along an airtight package 2 which is package on the surface of a multilayer substrate 10 and a feeding line via an inter-layer connecting line, a metallic terminal 13 and a connecting terminal 11. Electric power supply to an amplifier provided in a microwave integrated circuit and the phase control signal of a phase shifter are inputted from a control terminal 6 and the inter-layer connecting line is connected to a control line formed in the substrate 10 via the terminals 13 and 11. As an antenna radiation element 14 is integrally formed on the highest layer of the substrate 10, no connector is required and accordingly the size of an array antenna feeding device is reduced. Furthermore, no chassis is needed for avoiding the interference and therefore, the constitution of the antenna feeding device is simplified.
ARIGA HIROSHI
NAKAAZE HIROAKI
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