Title:
Art and composition relevant to a Capacitor assembly
Document Type and Number:
Japanese Patent JP6130880
Kind Code:
B2
Abstract:
Embodiments of the present disclosure are directed toward techniques and configurations associated with a capductor assembly. In one embodiment, a capductor assembly may include a semiconductor wafer and a plurality of inductors disposed on a first side of the semiconductor wafer. The plurality of inductors may be embedded in electrically insulative material having a plurality of interconnect structures disposed thereon. The plurality of interconnect structures may be configured to electrically couple the plurality of inductors to a die. The IC assembly may further include a plurality of capacitors disposed on a second side of the wafer disposed opposite the first side of the wafer. The plurality of capacitors may be electrically coupled with a second plurality of interconnect structures that may be configured to electrically couple the plurality of capacitors with the die. Other embodiments may be described and/or claimed.
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Inventors:
Lambert, William Jay.
Hill, Michael Jay.
Radha Krishnan, Karadhah
Hill, Michael Jay.
Radha Krishnan, Karadhah
Application Number:
JP2015139616A
Publication Date:
May 17, 2017
Filing Date:
July 13, 2015
Export Citation:
Assignee:
INTEL CORPORATION
International Classes:
H01L25/00
Domestic Patent References:
| JP2001274034A | ||||
| JP2007311649A | ||||
| JP2007019292A | ||||
| JP2009111261A | ||||
| JP2013531385A |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation