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Patent Searching and Data


Title:
ARTICLE FOR FORMING CONCEALMENT BODY, MOLDING, AND MOLDING METHOD
Document Type and Number:
Japanese Patent JP2005262618
Kind Code:
A
Abstract:

To provide a technique which does not need a special molding machine and a special apparatus even when a defective appearance occurs in a molding and can efficiently mold the molding free from the defective appearance and excellent in designability without a post-process.

A film 1 for forming a concealment body is constituted of a carrier film layer 2 and the concealment body 3. The concealment body 3 includes a joining layer 31 which can be fusion-bonded or adhered to a molding material, a concealment main body layer 32, a decorative layer 33, and a peeling layer 34 which facilitates the peeling between the carrier film layer 2 and the decorative layer 33. The trapezoidal molding 4 is constituted of a hollow trapezoidal molding main body 41 and a concealment layer 42 applied on a surface 45 so that a defective appearance spot such as a weld line 43 on the surface 45 is not checked visually.


Inventors:
IMAIZUMI MASARU
SUMIYA HARUHIKO
HISAMORI YOICHI
Application Number:
JP2004077862A
Publication Date:
September 29, 2005
Filing Date:
March 18, 2004
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B29C33/14; B29C45/14; (IPC1-7): B29C33/14; B29C45/14
Attorney, Agent or Firm:
Masuo Oiwa
Toshihide Kodama
Takenaka Ikuo
Keigo Murakami