Title:
ARTIFICIAL NAIL MOLDING CHIP
Document Type and Number:
Japanese Patent JP2004160110
Kind Code:
A
Abstract:
To provide an artificial nail molding chip which molds an artificial nail by embossing and is applied with a rapping design.
In a rapping nail die chip (1), a projection (9) is provided on the rear side of a middle portion of a top end for applying a rapping design (8). The molding chip is provided by integrating silicon or fluorine mold release coating (5) over surfaces of the rapping nail die chip (1), a nail die chip (2) and a lower nail die chip (3). A sphere (4) is provided to be adhered on a side portion of a top end of his/her nail (10).
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Inventors:
YOMOGIYAMA HIDETAKE
Application Number:
JP2002361502A
Publication Date:
June 10, 2004
Filing Date:
November 08, 2002
Export Citation:
Assignee:
YOMOGIYAMA HIDETAKE
EGUCHI SHIYOUKO
EGUCHI MITSUKAZU
EGUCHI SHIYOUKO
EGUCHI MITSUKAZU
International Classes:
A45D31/00; (IPC1-7): A45D31/00