Title:
組込方法及びこの方法により製造されたアセンブリ
Document Type and Number:
Japanese Patent JP5208500
Kind Code:
B2
Abstract:
An assembly (100) is provided comprising a first chip (20) and a second chip (30) which are interconnected through solder connections. These comprise, at the first chip, an underbump metallization and a solder bump, and, at the second chip, a metallization. In this case the solder bump is provided as a fluid layer with a contact angle of less than 90° C., and an intermetallic compound is formed on the basis of the metallization at the second chip, and at least one element of the composition is applied as the solder bump.
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Inventors:
Nicolas, Yeah, A. Fan, Fern
Hendrik, P. Hofstenbach
Hendrik, P. Hofstenbach
Application Number:
JP2007512626A
Publication Date:
June 12, 2013
Filing Date:
April 28, 2005
Export Citation:
Assignee:
NXP B.V.
International Classes:
H01L25/065; H01L21/60; H01L25/07; H01L25/18
Domestic Patent References:
| JP2002170918A | ||||
| JP6354738A | ||||
| JP2002124533A | ||||
| JP200243352A |
Attorney, Agent or Firm:
Kenji Yoshitake
Hidetoshi Tachibana
Takeshi Sekine
Takahashi
Hidetoshi Tachibana
Takeshi Sekine
Takahashi