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Title:
ASSEMBLING METHOD FOR LASER
Document Type and Number:
Japanese Patent JP2000261064
Kind Code:
A
Abstract:

To assemble a solid-state laser having less variation of laser properties by suppressing the distortion of a holding member due to the bonding of an optical element and the holding member in a laser, wherein the temperature of a resonator is controlled to be constant for stabilization.

After a plurality of optical elements 13, 14, 15 and 17 are bonded to fix to prescribed positions of a resonator unit 21 consisting of an optical element holding part of metal, the optical axis of a concave mirror 16 is so adjusted as to obtain the maximum output of a semiconductor laser 11. After adjusting the optical axis, the temperature of the laser is controlled to the optimum control temperature with a Peltier element 31, and then bonding agent is poured into between a resonator mirror 16 and a member holding it, and then the bonding agent is cause to cure to fix the resonator mirror 16.


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Inventors:
TANI TAKEHARU
OKAZAKI YOJI
Application Number:
JP5851799A
Publication Date:
September 22, 2000
Filing Date:
March 05, 1999
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
H01S3/03; H01S3/02; H01S3/094; (IPC1-7): H01S3/02; H01S3/03; H01S3/094
Attorney, Agent or Firm:
Seiji Yanagida (1 person outside)



 
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