Title:
BALL-SHAPED Au-Sn-Ag BASED SOLDER ALLOY, AND ELECTRONIC COMPONENT ENCAPSULATED USING THE BALL-SHAPED Au-Sn-Ag BASED SOLDER ALLOY AND DEVICE MOUNTED WITH ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2016073979
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a ball-shaped Au-Sn-Ag based solder alloy for high temperature which can be satisfactorily used even for bonding of an electronic component and a device mounted with an electronic component requiring extremely high reliability, such as a quartz device, am SAW filter and MEMS, has a melting point of 240 to 300°C, moreover, is excellent in particular in wettability and spreadability and in bonding property, further, has a low cost and is excellent in workability, stress relaxation property and reliability.SOLUTION: There is provided the ball-shaped Au-Sn-Ag based solder alloy which has such a shape that an aspect ratio (that is "major axis/minor axis" or "length side/width side" hereinafter the same) is 1.00 to 1.20 and which contains 55.0 to 70.0 mass% of Sn, 2.0 to 9.0 mass% of Ag and the balance comprised of Au with elements inevitably contained during production.SELECTED DRAWING: Figure 1
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Inventors:
IZEKI TAKASHI
Application Number:
JP2014203846A
Publication Date:
May 12, 2016
Filing Date:
October 02, 2014
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
B23K35/26; C22C13/00; H05K3/34
Domestic Patent References:
| JP2010214396A | 2010-09-30 | |||
| JP2005109484A | 2005-04-21 | |||
| JP2007331028A | 2007-12-27 | |||
| JP2008155221A | 2008-07-10 | |||
| JP2014104480A | 2014-06-09 | |||
| JP2016028829A | 2016-03-03 | |||
| JP2015208777A | 2015-11-24 |
Foreign References:
| WO2006049024A1 | 2006-05-11 |
Attorney, Agent or Firm:
Shinohara International Patent Office
Yasushi Shinohara
Masayuki Fujinaka
Kazuhiro Suzuki
Yasushi Shinohara
Masayuki Fujinaka
Kazuhiro Suzuki