Title:
STAMPING METHOD FOR ELECTRONIC PART
Document Type and Number:
Japanese Patent JP3232980
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make it possible to precisely stop a film carrier at the stamping position when indexing the film carrier with chips bonded thereon with a certain pitch and stamping to obtain electronic components.
SOLUTION: A film carrier 1 is indexed to a stamping section 20 equipped with an upper die 21 and a lower die 22 by means of sprockets 11, 12 and a first motor 13. A camera 30 is installed upstream the stamping section 20. The camera 30 is used to detect the position error of electronic components on the film carrier 1 in the direction of transport. The amount of indexing the film carrier 1 is adjusted so that the position error is corrected, and stamping operation is performed in the stamping area 20 to obtain electronic components.
More Like This:
Inventors:
Hidenari Shinozaki
Application Number:
JP24415995A
Publication Date:
November 26, 2001
Filing Date:
September 22, 1995
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP8227916A | ||||
| JP59225536A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)