Title:
BAND SAW DEVICE
Document Type and Number:
Japanese Patent JP2023082538
Kind Code:
A
Abstract:
To provide a band saw device which achieves reduction of a height of the entire device while securing a depth of a saw blade.SOLUTION: A band saw device 10 of the invention includes: a gate frame 12 which is disposed across a cut object between pillars 13; fixed wheels (21, 22) provided at the upper side of the pillars 13 of the gate frame 12; lifting wheels (23, 24) which are provided at the lower side of the pillars 13 of the gate frame 12 and move forward toward the cut object or rearward; a fixed wheel for traverse motion 25 provided between the fixed wheel and the lifting wheel; a traverse motion wheel 26 which is provided at a beam 14 of the gate frame and moves forward from the fixed wheel for traverse motion or rearward in a horizontal direction; and an endless saw blade 18 which is wound around the fixed wheels, the fixed wheel for traverse motion, the lifting wheels, and the traverse motion wheel and cuts the cut object between the lifting wheels facing the cutting object.SELECTED DRAWING: Figure 1
Inventors:
KITAHARA TAKASHI
MINEGISHI TAKAO
FURUKAWA TEI
KAWAMATA KUNIO
KIO KENJI
MORIGUCHI AKIRA
HAMAKAWA TETSUYA
FUJIWARA RYOJI
MINEGISHI TAKAO
FURUKAWA TEI
KAWAMATA KUNIO
KIO KENJI
MORIGUCHI AKIRA
HAMAKAWA TETSUYA
FUJIWARA RYOJI
Application Number:
JP2021196375A
Publication Date:
June 14, 2023
Filing Date:
December 02, 2021
Export Citation:
Assignee:
HITACH PLANT CONSTR LTD
International Classes:
B23D53/04; B23D55/00
Attorney, Agent or Firm:
Yuichi Murakami
Hiroshi Seki
Hiroshi Seki
Previous Patent: Airplane lavatory unit door opening/closing mechanism
Next Patent: PCa joining material
Next Patent: PCa joining material