Title:
BATTERY WIRING CIRCUIT BOARD AND BATTERY MODULE
Document Type and Number:
Japanese Patent JP2022088321
Kind Code:
A
Abstract:
To provide a miniaturized battery module and a battery wiring circuit board provided to the same.SOLUTION: A battery wiring circuit board 1 comprises: a stainless layer 5; a base insulation layer 6; and a conductive layer 7 in sequence toward a thickness direction one side. The stainless layer 5 is electrically connected to the conductive layer 7. The stainless layer 5 contains a first laser weld part 22 which can be welded with a laser. The first laser weld part 22 is exposed to the thickness direction one side and the other side.SELECTED DRAWING: Figure 1
Inventors:
INOUE MAYA
YAMAZAKI HIROSHI
TSUDA NAO
YAMAZAKI HIROSHI
TSUDA NAO
Application Number:
JP2021182750A
Publication Date:
June 14, 2022
Filing Date:
November 09, 2021
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H01M50/519; H01M50/202; H01M50/204; H01M50/216; H01M50/566
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda
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