Title:
BENDING PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2018069250
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To highly accurately detect a bending angle of a work, by increasing resolution power of a detection object part by a detection element with a simple structure.SOLUTION: A bending processing device comprises: a pair of movable dies in contact with both flat plate parts formed by sandwiching a fold line of a work; a punch for reciprocating toward a space between the pair of movable dies; a pair of support parts provided in a main body and rotatably supporting the pair of movable dies in directions opposite to each other in response to bending of the work by the punch; and an angle detection part for detecting any one or both of rotation angles of the pair of movable dies. The pair of movable dies comprise a convex curved surface part coming into rotatable slide contact with the pair of support parts, and a rotor interlocking with rotation of the pair of movable dies. The angle detection part comprises a detection object part provided in any one or both of rotors of the pair of movable dies, and a detection element provided on the main body side. In the rotors, the detection object part is formed in a circular arc shape made by lengthening a radius of rotation more than a radius of rotation up to the convex curved surface part from the rotation center of the pair of movable dies.SELECTED DRAWING: Figure 1
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Inventors:
YAMAMOTO TAKAHISA
Application Number:
JP2016207760A
Publication Date:
May 10, 2018
Filing Date:
October 24, 2016
Export Citation:
Assignee:
TY ASS KK
International Classes:
B21D5/02
Attorney, Agent or Firm:
Eichi International Patent Office