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Title:
BENDING RESISTANT CONDUCTOR AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2002241872
Kind Code:
A
Abstract:

To obtain a low cost bending resistant conductor used for various electronic parts, for example, a microminiature motor, various microminiature inductance or the like.

The bending resistant conductor, in which the ratio of the increase of the number of times of bending rapture to the increase of tensile strength in a region of ≥900 MPa tensile strength is ≥1 number of time/MPa, is obtained by using a Cu-Ag alloy containing 2-14 wt.% Ag and the balance Cu with inevitable impurity.


Inventors:
MORIYASU TAKESHI
NAKATSU TERUTO
Application Number:
JP2001033073A
Publication Date:
August 28, 2002
Filing Date:
February 09, 2001
Export Citation:
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Assignee:
SHOWA ELECTRIC WIRE & CABLE CO
International Classes:
C22F1/08; C22C9/00; C22F1/00; H01B1/02; H01B7/00; H01B13/00; (IPC1-7): C22C9/00; C22F1/08; H01B1/02; H01B7/00; H01B13/00
Domestic Patent References:
JPH06287728A1994-10-11
JPH11293365A1999-10-26
JPH11293431A1999-10-26
JP2000199042A2000-07-18
JP2001052528A2001-02-23
JPH06287729A1994-10-11
JP2001040439A2001-02-13
JP2002121629A2002-04-26
Attorney, Agent or Firm:
Yuji Kato