Title:
BENDING TOOL FOR ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JPH08186214
Kind Code:
A
Abstract:
PURPOSE: To prevent application of a large stress at the time of bending the lead of an electronic device by positioning the lead on a die member by means of the positioning part and then pressing a punch member against the die member by means of a punching member thereby bending the lead member. CONSTITUTION: A punching member 1 comprises first and second members 3, 4 fixed rotatably through a pin 2. The first member 3 is provided, on the forward end side thereof, with a punch member 5 and the second member 4 is provided, on the forward end side thereof, with a die member 6 oppositely to the punch member 5. The lead 8 of a transistor 7 is positioned by means of the positioning part, i.e., the upper surface 6a, of the die member 6 and an engaging protrusion 6b. The punch member 5 is pressed, by means of the punching member 1, against the die member 6 thus bending the lead 8 of the transistor 7 toward a recess 6C. With such structure, a large stress is not applied to the lead 8 when it is bent and electrical disconnection can be prevented between the body part and the lead 8 of the transistor 7.
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Inventors:
MATSUBA KENJI
TSURUOKA TAKASHI
TSURUOKA TAKASHI
Application Number:
JP32660194A
Publication Date:
July 16, 1996
Filing Date:
December 28, 1994
Export Citation:
Assignee:
OTIS ELEVATOR CO
International Classes:
B25B7/22; B21D5/01; B21F1/00; H01L23/48; (IPC1-7): H01L23/48; B21D5/01; B21F1/00; B25B7/22
Attorney, Agent or Firm:
Fujiya Shiga (1 person outside)
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