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Patent Searching and Data


Title:
PACKAGE LEAD OF LIGHT TRANSMIT-RECEIVE MODULE
Document Type and Number:
Japanese Patent JPH08186215
Kind Code:
A
Abstract:

PURPOSE: To reduce a wiring length by forming each of a plurality of package leads by adjusting any of a length from an edge face, an angle to an edge face and a height from a substrate.

CONSTITUTION: A pillar shaft of light transmit-receive modules 12, 22 formed to a pillar is arranged parallel to a surface of transmit-receive substrates 13, 23. A plurality of package leads 60 attached to project to one edge face of the light transmit-receive modules 12, 22 and an electrode 70 provided on a transmit-receive substrate are connected by a metallic wire 50. Each of a plurality of package leads 60 is formed by adjusting any of a length from an edge face, an angle to an edge face and a height from the transmit-receive substrates 13, 23. Thereby, the package lead 60 and the metallic wire 50 can be attached by reducing a length of the sum thereof.


Inventors:
MORIYAMA YUTAKA
TAKAHASHI HISATO
Application Number:
JP32699994A
Publication Date:
July 16, 1996
Filing Date:
December 28, 1994
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01L25/10; H01L23/02; H01L23/48; H01L23/50; (IPC1-7): H01L23/48; H01L23/02; H01L25/10
Attorney, Agent or Firm:
Tetsuji Ueshiro (2 outside)