Title:
ベンゾオキサジン化合物、ベンゾオキサジン樹脂、ベンゾオキサジン樹脂の製造方法、硬化性樹脂組成物、その硬化物、ＦＲＰ材料、半導体封止材料、ワニス、回路基板、プリプレグ、及びビルドアップフィルム
Document Type and Number:
Japanese Patent JP6413740
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a benzoxazine compound and a benzoxazine resin each of which provides a cured article excellent in various properties of heat resistance, resistance to pyrolysis, fire retardancy and dielectric property, and to provided a method of producing the benzoxazine resin, a curable resin composition, the cured article thereof, an FRP material, a semiconductor encapsulation material, a varnish, a circuit board, a prepreg and a build-up film.SOLUTION: There is provided the benzooxazine compound obtained by reacting a phenol compound having a molecular structure represented by the formula (I), with a monoamine compound and formaldehyde. HO-X-OH(I) [in the formula (I), X is a structural site represented by the following formula (x1) or (x2) ].SELECTED DRAWING: None
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Inventors:
Ayumu Takahashi
Yasushi Sato
Yasushi Sato
Application Number:
JP2014253998A
Publication Date:
October 31, 2018
Filing Date:
December 16, 2014
Export Citation:
Assignee:
DIC Corporation
International Classes:
C07D265/36; C08G14/073; C08J5/24; C08K3/00; C08L61/34; C09D161/34; H01L23/29; H01L23/31; H05K1/03
Domestic Patent References:
| JP5621954B2 | ||||
| JP5637419B2 | ||||
| JP41012230B1 | ||||
| JP2013249280A | ||||
| JP2000273135A | ||||
| JP2001214029A | ||||
| JP2001278934A | ||||
| JP11217416A | ||||
| JP2002161188A |
Foreign References:
| WO2014199662A1 |
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Makoto Negishi
Akihiro Iwamoto
Takayuki Ohno
Makoto Negishi