Title:
BINDER COMPOSITION FOR MOLDING MOLD
Document Type and Number:
Japanese Patent JP2016107328
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a binder composition for molding a mold which makes it possible to obtain a sufficient curing rate while preventing the occurrence of hazardous substance and hazardous gas such as SOx, and a composition for a mold and a method for producing a mold.SOLUTION: A binder composition for molding a mold comprises a compound having an ureido group at a terminal, and a furan aldehyde compound. There are also provided a composition for a mold which comprises the same, and a method for producing a mold using the same.SELECTED DRAWING: None
Inventors:
JOYA TAKASHI
ARAKAWA KAZUTO
ARAKAWA KAZUTO
Application Number:
JP2014250059A
Publication Date:
June 20, 2016
Filing Date:
December 10, 2014
Export Citation:
Assignee:
KAO CORP
International Classes:
B22C1/22; B22C1/02; C08G73/06
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office