PURPOSE: To obtain a low-priced and strengthened cutter preferable for cutting a lead wire under a printed substrate, by using a thin disc of sintered material, in which Al2O3 is added to a mixture containing one kind or more of yttria, magnesia and calcia in zirconia, and evaporating one kind of SiC, Si3N4, TiN, WC to a blade.
CONSTITUTION: Yttria is combined with zirconia, further after dewatering and drying by adding Al2O3, temporary firing is performed, and a cutter is formed by rubber press molding and hot press molding. And after hot press sintering, the cutter, which obtains a disc forming a blade in the periphery of the disc after accurate machining a d evaporating SiC to the blade, obtains the blade of good sharpness after the final machining. This blade 1 is mounted to the lead cutter, and the blade, if it is used for cutting a lead wire 2 under a printed substrate 3, endures against the use for a long time. In this way, the low-priced and strengthened cutter, which is not oxidized in a high temperature and preferable for cutting the lead wire in an IC circuited board where water cooling is unable, can be obtained.
KOMATSU MASAO
KIUCHI NORIHIRO
TOMINAGA TSUTOMU
ADAMANDO KOGYO KK
NIPPON MINING CO
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