Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LEAD CUTTER FOR ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JPS62271620
Kind Code:
A
Abstract:

PURPOSE: To prevent a trouble from being generated in a printed substrate or the like, by forming space in claw parts of claw structures in a lead cutter so that cutting chips of a lead wire are left remaining in the space being prevented from scattering to the outside.

CONSTITUTION: Two opposed arms 64, 64 of a lead cutter 5 are placed approaching by lowering a piston. Cutting edges 81, 81 are provided in claw parts 78, 78 of claw structures 76, 76 in the bottom end part of the arms 64, 64, and a lead 89 is cut by the cutting edges 81, 81 coming into contact. The claw part is constituted such that space 85 is formed between the claw parts 78, 78 when they are connected, causing a cutting chip 90 of the lead 89 to be contained in the space 85. The cutting chip 90 is attracted and discharged thereafter via a suction pipe 87. Accordingly, a trouble due to the cutting chip is removed.


Inventors:
MURAKAMI SHIGERU
Application Number:
JP11224186A
Publication Date:
November 25, 1987
Filing Date:
May 16, 1986
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SONY CORP
International Classes:
B23D17/00; B23D17/02; H05K13/04; (IPC1-7): B23D17/02; H05K13/04
Attorney, Agent or Firm:
Yuji Komatsu



 
Previous Patent: METALLIC BREAKING SHEARING MACHINE

Next Patent: BLADE FOR CUTTER