Title:
BLADE-LIKE CONNECTING NEEDLE
Document Type and Number:
Japanese Patent JP2002311052
Kind Code:
A
Abstract:
To provide a blade-like connecting needle for measuring a semiconductor wafer capable of greatly improving measuring capacity of a minute electric current, and having stable characteristics.
The blade shaped connecting needle 1 for measuring the semiconductor wafer and a manufacturing method of the same includes a blade signal line 10 for transmitting a signal from a semiconductor wafer, a support insulator 8 for covering at least a part of the blade signal line 10, blade guard patterns 12a, 12b, 12c, 12d for providing electromagnetic shield to the blade signal line 10 formed in an inside or on a surface of the support insulator 8, and a probe needle 2 held by the support insulator 8 and connected to the blade signal line 10.
Inventors:
IWASAKI HIROYUKI
Application Number:
JP2001114861A
Publication Date:
October 23, 2002
Filing Date:
April 13, 2001
Export Citation:
Assignee:
AGILENT TECHNOLOGIES JAPAN LTD
International Classes:
G01R1/067; G01R1/073; G01R3/00; H01L21/66; (IPC1-7): G01R1/067; G01R1/073; H01L21/66
Attorney, Agent or Firm:
Okuyama Shoichi (2 outside)
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