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Patent Searching and Data


Title:
BLOCK MOLDING AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JPH10265250
Kind Code:
A
Abstract:

To increase adhesive strength on boundary surface and between particles by closely tangling a mixture A, which is composed of an aggregate and a binder, with a mixture B, which is composed of the aggregate and a water-resistant resin binder, and/or allowing the aggregates in at least either A or B to penetrate the binder layer of the other on the joint surface between the mixture A and the mixture B.

The mixture A and B are closely tangled with each other and/or at least the aggregate in either A or B penetrates the binder layer of the other on the joint surface between a cement based solidifying agent Al, which is composed of the A aggregate 3 and the binder 4 such as a cement based solidifying agent, and the resin based mixture B2, which is composed of the B aggregate 5 and a water-resistant resin binder such as a polysulfide modified epoxy resin 6. They are combined with each other in uncured state and molded into a block molding. A polysulfide modified epoxy resin is a compound expressed by the formula (each of R1 and R2 is an alkylene or the like, each of R3 and R4 is an epoxy prepolymer residue, m>1, (a) is 0-5, (b) is 1-50 and at least one of X and Y is S or the like) and is used together with a modified polyamine hardening agent.


Inventors:
KAMAISHI TADAMI
OSADA HIDEHARU
Application Number:
JP6964097A
Publication Date:
October 06, 1998
Filing Date:
March 24, 1997
Export Citation:
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Assignee:
TORAY INDUSTRIES
OSADA GIKEN KK
International Classes:
E01C5/22; B32B13/12; C04B26/14; C04B28/02; C08G59/14; (IPC1-7): C04B26/14; B32B13/12; C04B28/02; C08G59/14; E01C5/22
Attorney, Agent or Firm:
Mikio Kagawa