Title:
SUBSTRATE INSPECTION DEVICE, SUBSTRATE INSPECTION SYSTEM AND SUBSTRATE INSPECTION METHOD
Document Type and Number:
Japanese Patent JP2023052161
Kind Code:
A
Abstract:
To improve defect inspection accuracy in a defect inspection based on a picked-up image obtained by picking up an inspection object substrate.SOLUTION: A substrate inspection device for inspecting a substrate, comprises: an acquisition unit which acquires an estimated image of an inspection object substrate after processing by a substrate processing device based on an image estimation model created by machine learning by using a picked-up image before the processing and a picked-up image after the processing by the substrate processing device for each of a plurality of substrates and the picked-up image of the inspection object substrate before the processing by the substrate processing device; and a determination unit which determines presence/absence of a defect of the inspection object substrate on the basis of the picked-up image of the inspection object substrate after the processing by the substrate processing device and the estimated image.SELECTED DRAWING: Figure 7
Inventors:
Iwanaga Shuji
Nao Nishiyama
Nao Nishiyama
Application Number:
JP2022211579A
Publication Date:
April 11, 2023
Filing Date:
December 28, 2022
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G06T7/00; G01N21/956; G06V10/82; H01L21/66
Attorney, Agent or Firm:
Kanemoto Tetsuo
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine