To provide a clamp ring and a board processing device using the same that can be used for a longer period of time.

The clamp ring 10 is used to press down a wafer 8 and fix it onto a wafer holding body 1 in a sputtering film formation device, and it is provided with a first metal sheet 11 that is brought into contact with the wafer 8 when the wafer 8 is fixed, a second metal sheet 12 that is placed on the first metal sheet 11 and is smaller in width than the first metal sheet 11, and a sheet housing part 9a to house the first and the second metal sheets 11 and 12. The wafer is fixed on the wafer holding body while it is pressed down by means of the first metal sheet 11, and in this case, the first metal sheet 11 is bent in a dog leg shape at the end of the second metal sheet 12.