Title:
板材加工用組成物、板材積層物及び板材積層物の製造方法
Document Type and Number:
Japanese Patent JP7329294
Kind Code:
B2
Abstract:
Provided is a board material processing composition enabling manufacture of a board material laminate which is noncombustible and superior in adhesive performance. In order to solve this problem, a board material processing composition that inhibits combustion of a board material due to heating contains: an inorganic carbonization promotion component that promotes carbonization of an organic component in the board material during the heating; an inorganic chain inhibition component that inhibits a reaction chain to adjacent components due to a product of endothermic decomposition generated during the heating; and inorganic hydrophobic binder particles that adhere the organic component in the board material with the carbonization promotion component and the chain inhibition component.
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Inventors:
Toshinori Hattori
Application Number:
JP2023516407A
Publication Date:
August 18, 2023
Filing Date:
March 30, 2022
Export Citation:
Assignee:
M&H Giken Co., Ltd.
International Classes:
C09K21/02; B27D1/04; B27K3/20; B27K3/32; C09K21/04
Domestic Patent References:
| JP4161688A | ||||
| JP2006182024A | ||||
| JP6099407A | ||||
| JP51127596A | ||||
| JP2116505A |
Foreign References:
| US4168175 |
Attorney, Agent or Firm:
Patent Attorney Corporation Isono International Patent and Trademark Office