Title:
基板処理装置および基板処理方法
Document Type and Number:
Japanese Patent JP7051334
Kind Code:
B2
Abstract:
To remove a peripheral part of a coated film suitably and inhibit splash of a stripping solution from a solution receiving part.SOLUTION: A substrate processing apparatus 1 comprises: a stripping solution supply part 6 for supplying a stripping solution to a peripheral region 93 of an upper surface 91 of a rotating substrate 9 to strip off from the substrate 9, a coating film on the substrate 9 at a part on the peripheral region 93; and a cup part 4 arranged around a substrate holding part 31 to receive the rinse solution splashed around from the rotating substrate 9. The stripping solution supply part 6 includes a blending part 61 and a fourth nozzle 64 as a stripping solution discharge part. The blending part 61 blends a water-soluble organic solvent with an aqueous solvent to create the stripping solution. The fourth nozzle 64 discharges toward the substrate 9, the stripping solution delivered from the blending part 61. This makes it possible to remove a peripheral part of a coating film formed on the substrate 9 suitably and inhibit splash of the stripping solution from the cup part 4.SELECTED DRAWING: Figure 1
More Like This:
| JP2023071083 | WAFER PROCESSING METHOD |
| JPS61239628 | CLEANING OF SEMICONDUCTOR SUBSTRATE |
| JP4391320 | Docking board transfer and processing system |
Inventors:
Naozumi Fujiwara
Application Number:
JP2017167360A
Publication Date:
April 11, 2022
Filing Date:
August 31, 2017
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304
Domestic Patent References:
| JP2014107313A | ||||
| JP2015023172A | ||||
| JP2015095583A | ||||
| JP2003275696A | ||||
| JP2008311266A | ||||
| JP2007335815A | ||||
| JP2008177495A | ||||
| JP2008060106A | ||||
| JP2008034779A | ||||
| JP2008085164A | ||||
| JP2008198958A |
Attorney, Agent or Firm:
Masahiro Matsuzaka
Tsutomu Tanaka
Yamamura Issei
Tsutomu Tanaka
Yamamura Issei